Low-kmaterials相关论文
Effects of the UV Treated SiCN Capping Layer on the SiOC(-H) Film Prepared by Plasma-Enhanced Atomic
Multilevel interconnection structures comprising of low-k films with inlaid copper wires in a dual damascene process hav......
Structural and Electrical Properties of the Low-k SiOC(-H) Film Prepared with Plasma-Enhanced Atomic
SiOC(-H) thin films with low-dielectric-constant have been prepared by using plasma-enhanced atomic layer deposition.I-V......
Low-k materials as SiO2 play important role in semiconductor industry and the plasma is one of the mostly used tools for......
